Source: FUNDAMENTALS OF MICROSYSTEMS PACKAGING C H A P T E 1. R INTRODUCTION TO MICROSYSTEMS PACKAGING Prof. Rao R. Tummala. “LEARN ABOUT MICROSYSTEMS PACKAGING FROM THE GROUND UP Written by Rao Tummala, the fields leading author, Fundamentals of Microsystems. FUNDAMENTALS OF. MICROSYSTEMS PACKAGING. Rao R. Tummala. Georgia Institute of Technology. Editor. Angie Hughes. Nancy Trent. Mahesh.
|Published (Last):||10 June 2018|
|PDF File Size:||20.19 Mb|
|ePub File Size:||14.43 Mb|
|Price:||Free* [*Free Regsitration Required]|
Add a review and share your thoughts with other readers.
Please enter the message. Looking for beautiful books? Would you also like to submit a review for this item? Would you like to tell us about a lower price?
ComiXology Thousands of Digital Comics. Introduction to microsystems packaging — Role of packaging in microelectroncis — Role of packaging in microsystems — Fundamentals of electrical package design — Fundamentals of design for reliability — Fundamentals of thermal management — Fundamentals of single chip packaging — Fundamentals of multichip packaging — Fundamentals of IC assembly — Fundamentals of wafer-level packaging — Fundamentals of passives: Product details Paperback Publisher: Top Reviews Most recent Top Reviews.
Available soon, pre-order now. User lists Similar Items. Please enter recipient e-mail address es. For the autodidact, the scholar, or microsysgems flagellant, there are even homework problems to test your knowledge. Cancel Forgot your password?
Fundamentals of Microsystems Packaging
Professor Tummala’s latest book should appeal to only three groups: Showing of 2 reviews. For the specialist, who must build upon these foundations, each chapter includes a judicious selection of recommended further readings. Electronic packaging — Handbooks, manuals, etc. Amazon Renewed Refurbished products with a warranty. Your rating has been recorded. Please try again later.
Fundamentals of Microsystems Packaging, Second Edition
The only book to cundamentals microsystems packaging written by the field’s leading author. Fundamentals of Microsystems Packaging, Second Edition.
Explore the Home Gift Guide. We’re featuring millions of their reader ratings on our book pages to help you find your new favourite book.
Fundamentals of microsystems packaging Author: Please verify that you are not a robot. English View all editions and formats. You may send this item to up to five recipients.
Your list has reached the maximum number of items. Amazon Inspire Digital Educational Resources. The author of Microelectronics Packaging Handbook, Volumes I, II, and III, the best-selling reference that defines the entire field, he is an electronics and materials engineer and an experienced designer of microelectronics. E-books EL items by zahid. You already recently rated this item. Fundamentals of microsystems packaging.
Fundamentals of Microsystems Packaging, Second Edition : Rao Tummala :
Linked Data More info about Linked Data. Please re-enter recipient e-mail address es.
Alexa Actionable Analytics for the Web. Check out the top books of the year on our page Best Fundamnetals of Customers who viewed this item also viewed. Miniaturization of the Entire System.